The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
May. 02, 2001
Doug Baumann, San Jose, CA (US);
Louis Pandula, Sunnyvale, CA (US);
ZeeVo, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present invention provide flip-chip bond pad arrangements that lead to a smaller increase in die size than conventional approaches. This is accomplished by using the core side of a periphery I/O pad ring for placing some of the bond pads in order to meet the bond pad pitch requirements of flip chip technology. For example, alternating bond pads are moved inward to the core side of the I/O pads or drivers, to meet the bond pad pitch requirement between the bond pads that are moved to the core side as well the bond pads that remain outside of the core. Because the bond pads are moved inward instead of outward, the increase in the die size from the edge of the I/O pad ring is reduced. In an alternative embodiment, the bond pads are each bonded on top of an active circuitry of a corresponding I/O pad. In another alternative embodiment, the bond pads are disposed between I/O pads which are spaced from each other by a spacing in the direction of the periphery of the core to accommodate the bond pads.