Dorrance E McLean

Title: Dorrance E McLean: Innovator in Electroforming Technology

Introduction

Dorrance E McLean is a notable inventor based in Manteca, CA (US). He has made significant contributions to the field of electroforming technology, particularly in the development of methods for creating high aspect ratio micro-parts. His innovative approach has implications for various applications in microsystem fabrication.

Latest Patents

Dorrance E McLean holds a patent for an "Apparatus and method for electroforming high aspect ratio micro-parts." This patent describes a fixture designed to facilitate the proper orientation and spacing of a workpiece within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate, such as a silicon wafer, which is commonly used in LIGA or microsystem fabrication. The fixture allows the workpiece to be submerged deep within an electrolytic cell while facing upwards, enabling easy transfer between cells. Additionally, the edges, backside, and electrical connections of the workpiece are sealed and protected from the electrolyte.

Career Highlights

Dorrance E McLean is associated with Sandia Corporation, where he has contributed to various projects and innovations. His work has been instrumental in advancing the capabilities of electroforming technology, which is crucial for the production of micro-scale components.

Collaborations

Throughout his career, Dorrance has collaborated with notable colleagues, including Matthew W Losey and John T Hachman. These collaborations have fostered a productive environment for innovation and development in their respective fields.

Conclusion

Dorrance E McLean's contributions to electroforming technology exemplify the impact of innovative thinking in engineering. His patent and work at Sandia Corporation highlight the importance of advancements in micro-part fabrication.