Suwon, South Korea

Donk-sik Shim

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donk-sik Shim. Retrieved from https://idiyas.com/inventor/donk-sik-shim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Donk-sik Shim: Innovator in Inkjet Printhead Technology

Introduction

Donk-sik Shim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of inkjet printing technology. His innovative work focuses on overcoming challenges related to print quality.

Latest Patents

Donk-sik Shim holds a patent for an "Inkhead printhead configured to overcome impaired print quality due to nozzle blockage, printing method using the same, and method of manufacturing the inkjet printhead." This invention includes a substrate with an ink feed hole, a chamber layer with main and compensation ink chambers, and a nozzle layer with corresponding nozzles. This design aims to enhance the performance and reliability of inkjet printheads.

Career Highlights

Shim is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative printing solutions. His work has been instrumental in advancing the capabilities of inkjet technology.

Collaborations

Some of his notable coworkers include Moon-chul Lee and Myong-jong Kwon, who have collaborated with him on various projects within the company.

Conclusion

Donk-sik Shim's contributions to inkjet printhead technology exemplify the importance of innovation in enhancing print quality. His patent reflects a commitment to solving real-world problems in the printing industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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