Shanghai, China

Dongye Yang

This inventor holds 1 USPTO granted patent. Top assignee: Dell Products Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongye Yang. Retrieved from https://idiyas.com/inventor/dongye-yang-i2qcuchs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Dongye Yang and Cluster Deployment Innovation.

Introduction

Dongye Yang is an inventor based in Shanghai, China, and is associated with Dell Products Inc. His listed patent concerns a method for creating multi-node clusters more efficiently.

Latest Patents

Yang is credited with 1 patent, titled “Fast Method for Creating Multi-Node Clusters.” The disclosed method boots a first cluster node from attached storage into a bootstrap operating system, which starts PXE and file-sharing services. Software bundles for a target operating system are copied to the first node’s persistent storage. Other nodes then boot into the bootstrap operating system and connect to the first node through a high-speed switch, allowing the software bundles to be transferred to them.

Career Highlights

The available information associates Yang with Dell Products Inc. and identifies his work on a cluster-provisioning approach designed to distribute operating-system software across multiple nodes.

Collaborations

Jun Chen and Yun Sun are listed as Yang’s coworkers. The provided information does not specify their roles in the patent.

Conclusion

Dongye Yang’s listed patent describes a coordinated approach to bootstrapping and provisioning multi-node clusters, using attached storage, PXE services, and a high-speed network connection.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…