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For the Inventor, By the Inventor

Seongnam, South Korea

Dongwon Lee

This inventor holds 10 USPTO granted patents and 2 published patent applications. Top assignees: Line Corporation, Solid, Inc., Line Plus Corporation. Active years: 2018-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongwon Lee. Retrieved from https://idiyas.com/inventor/dongwon-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal6 out of 186 
 
Line Corporation
 patents
silverMedal2 out of 173 
 
Solid, Inc.
 patents
bronzeMedal1 out of 139 
 
Line Plus Corporation
 patents
4. 1 out of 25 
 
Naver Business Platform Corporation
 patents

Years Active: 2018-2023

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10 patents (USPTO):Explore Patents
1. 11751285 - Method and apparatus for connecting user terminals as a group and providing service including contents associated with the group (2023-09-05),
2. 11343299 - Method and system for real time measuring quality of video call service (2022-05-24),
3. 11337272 - Method and apparatus for connecting user terminals as a group and providing service including contents associated with the group (2022-05-17),
4. 11268822 - Method and system for navigation using video call (2022-03-08),
5. 11223662 - Method, system, and non-transitory computer readable record medium for enhancing video quality of video call (2022-01-11),
6. 11032408 - Method and system for automatically connecting calls of voice over internet protocol (VOIP) service (2021-06-08),
7. 10559869 - Base station interface device of distributed antenna system (2020-02-11),
8. 10271044 - Method and system for checking video call quality of mobile terminal (2019-04-23),
9. 10244427 - Systems and methods for suppressing and/or concealing bandwidth reduction of VoIP voice calls (2019-03-26),
10. 10003119 - Base station interface device of distributed antenna system (2018-06-19),

Title: Innovations of Dongwon Lee

Introduction

Dongwon Lee is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of technology, holding a total of 10 patents. His work primarily focuses on enhancing user connectivity and improving video call services.

Latest Patents

One of his latest patents is a method and apparatus for connecting user terminals as a group and providing service including contents associated with the group. This innovative connection service allows a first user terminal to send a connection request signal to other user terminals through an inaudible frequency range. This method initiates a group connection and provides associated services on the first user terminal. Another notable patent is a method and system for real-time measuring the quality of video call service. This method involves processing original video frames and replacing real-time video frames with portions of the original frames to enhance the quality of video calls.

Career Highlights

Throughout his career, Dongwon Lee has worked with notable companies such as Line Corporation and Solid, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas.

Collaborations

Dongwon has collaborated with talented individuals, including Jungjun Park and In Won Cho. Their teamwork has contributed to the successful development of various projects and patents.

Conclusion

Dongwon Lee's innovative contributions to technology, particularly in user connectivity and video call services, highlight his importance as an inventor. His patents reflect a commitment to improving communication technology and enhancing user experiences.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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