This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Donguk Kwon: Inventor of a Solder Reflow Innovation
Introduction
Donguk Kwon is an inventor associated with Suwon-si, South Korea, and Samsung Electronics Ltd. His patent work addresses soldering methods for assembling electronic devices.
Latest Patents
Kwon is associated with 1 patent: “Solder reflow apparatus and method of manufacturing an electronic device.” The patent describes a method that uses vapor passage holes through a substrate to deliver heated vapor to solder bumps connecting electronic components. The process includes preparing a substrate with multiple mounting regions, forming the passage holes, placing components on the substrate via bumps, and using vapor generated from a heat-transfer fluid to solder the connections.
Career Highlights
Kwon’s documented patent contribution focuses on improving how heat is delivered during electronic-device manufacturing. The approach uses vapor passing through the substrate, offering a distinct method for soldering component connections.
Collaborations
Kwon’s listed coworkers include Youngja Kim and Youngmin Lee. His patent is associated with Samsung Electronics Ltd.
Conclusion
Donguk Kwon’s patent documents an approach to electronic-device assembly that uses vapor passage holes and heated vapor to solder components to a substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile