Company Filing History:
Years Active: 2025
Title: The Innovative Contributions of Dongliang Liu
Introduction
Dongliang Liu is a prominent inventor based in Dongguan, China. He has made significant contributions to the field of resin compositions, particularly in the development of materials used in electronic applications. His innovative work has led to the creation of a patented resin composition that enhances the performance of adhesive films and copper foils.
Latest Patents
Dongliang Liu holds a patent for a resin composition and its use, which includes a unique formulation comprising 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler used is silicon dioxide, prepared through an organosilicone hydrolysis method. This composition is designed to achieve a higher elongation rate, improved peel strength, low coefficient of thermal expansion (CTE), and better drilling processability. The resin composition is particularly beneficial for printed circuit board materials, especially multilayer laminates with thin lines.
Career Highlights
Dongliang Liu is associated with Shengyi Technology Co., Ltd., where he continues to innovate and develop advanced materials for the electronics industry. His work has been instrumental in enhancing the capabilities of resin-coated materials, making them more efficient and reliable for various applications.
Collaborations
Dongliang Liu collaborates with his coworker, Qing Wang, to further advance their research and development efforts in the field of resin compositions. Their combined expertise contributes to the innovative solutions offered by Shengyi Technology Co., Ltd.
Conclusion
Dongliang Liu's contributions to the field of resin compositions exemplify the impact of innovation in the electronics industry. His patented work not only enhances material performance but also paves the way for future advancements in technology.