This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Dongkyu Kim: Semiconductor Packaging Inventor.
Introduction
Dongkyu Kim is an inventor based in Anyang-si, South Korea. His listed patent work concerns semiconductor packaging, and he is associated with Samsung Electronics Ltd.
Latest Patents
Kim is credited with 1 patent: “Semiconductor Package and Method of Manufacturing the Same.” The invention describes a package with lower and upper semiconductor chips, redistribution layers, vertical interconnectors, and a molding portion. The design places an intermediate connection member between the chips and uses the molding portion to surround and support key package components.
Career Highlights
The available information identifies Kim’s work at Samsung Electronics Ltd. and highlights his contribution to semiconductor package design and manufacturing.
Collaborations
Kim’s listed coworkers include Jongyoun Kim and Seokhyun Lee.
Conclusion
Dongkyu Kim’s recorded patent reflects work on semiconductor packaging structures that integrate multiple chips and interconnects within a molded package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile