Hwaseong-si, South Korea

Dongju Jang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):

Title: Dongju Jang - Innovator in Semiconductor Packaging

Introduction

Dongju Jang is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Dongju Jang holds a patent for a semiconductor package. This innovative package includes a lower substrate with a lower wiring layer, a semiconductor chip positioned on the lower substrate, and an upper substrate placed on the semiconductor chip. The upper substrate features a lower surface that faces the semiconductor chip, an upper wiring layer, and several protruding structures located beneath the lower surface. Notably, the lower surface of the upper substrate contains a cavity region that overlaps the semiconductor chip in a first direction, along with multiple channel regions extending from the cavity region to the edge of the upper substrate. The cavity region and channel regions are defined by the protruding structures, which enhance the overall design and functionality of the semiconductor package. He has 1 patent to his name.

Career Highlights

Dongju Jang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves working on advanced semiconductor technologies, contributing to the development of innovative products that meet the demands of modern electronics.

Collaborations

Throughout his career, Dongju has collaborated with talented individuals such as Junwoo Park and Seunghwan Kim. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Dongju Jang is a prominent figure in the semiconductor packaging industry, known for his innovative designs and contributions to technology. His work at Samsung Electronics Co., Ltd. and his patent for a semiconductor package highlight his commitment to advancing the field.

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