Hwaseong, South Korea

Dongil Kim

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongil Kim. Retrieved from https://idiyas.com/inventor/dongil-kim-kjcj3jes

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dongil Kim and His Patent for Substrate Polishing Technology.

Introduction

Dongil Kim is an inventor based in Hwaseong, South Korea. His work includes a patent related to slurry delivery and substrate polishing equipment. The available information identifies Samsung Electronics Co., Ltd. as his company.

Latest Patents

Kim is associated with 1 patent: “Slurry Supply Device, Substrate Polishing Apparatus, and Substrate Polishing Method.” The invention describes a slurry supply device with a slurry distribution part and a connected support part. A guide bar has a slot extending in one direction, while a distribution bar fits into the slot and contains a recessed distribution channel. A slurry delivery member supplies slurry to that channel. The patent also concerns a substrate polishing apparatus and a method for polishing a substrate.

Career Highlights

The patent reflects work on equipment designed to distribute slurry for substrate polishing. Its described components include a supported distribution assembly, a channel for guiding slurry, and a delivery member.

Collaborations

The provided information lists Seungchul Lee and Hyunjoon Park as Kim’s coworkers. It does not specify their roles in the patent or whether they collaborated on the invention.

Conclusion

Dongil Kim’s patent focuses on a slurry distribution system for substrate polishing, connecting his inventive work with semiconductor manufacturing equipment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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