Company Filing History:
Years Active: 2025
Title: Innovations of Dongho Chae in Adhesive Technology.
Introduction
Dongho Chae is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of adhesive technology, particularly through his innovative patent.
Latest Patents
Dongho Chae holds a patent for an adhesive composition, as well as a coverlay film and printed circuit board that incorporate this composition. The adhesive composition consists of an epoxy resin and a binder resin that includes epoxidized polybutadiene rubber along with at least two types of rubber. This innovative adhesive composition is designed to create an adhesive layer that excels in various properties, including adhesiveness, fluidity, filling capabilities, migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.
Career Highlights
Dongho Chae is currently employed at Doosan Corporation, where he continues to develop and refine adhesive technologies. His work has positioned him as a key figure in the advancement of materials used in electronic applications.
Collaborations
He collaborates with talented coworkers, including Kwangseok Park and Euidock Ryu, who contribute to the innovative projects at Doosan Corporation.
Conclusion
Dongho Chae's contributions to adhesive technology demonstrate his expertise and commitment to innovation in the field. His patent reflects a significant advancement that can enhance the performance of electronic components.