Suzhou, China

Dong Wu

This inventor holds 2 USPTO granted patents and 3 published patent applications and 2 EPO patents. Top assignees: Magnera Corporation, Nanhai Nanxin Non-Woven Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Wu. Retrieved from https://idiyas.com/inventor/dong-wu-c67cl9hh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Dong Wu - Innovator in Biomedical Engineering

Introduction

Dong Wu is an inventor based in Suzhou, China. He is associated with Suzhou Hybiome Biomedical Engineering Co., Ltd. Although he currently holds no granted patents, his work in the field of biomedical engineering is noteworthy. His contributions focus on developing innovative materials and technologies that have the potential to impact the industry significantly.

Latest Patent Applications

Dong Wu has submitted several patent applications that showcase his inventive capabilities. One of his latest applications is for a "Liquid Barrier and Air-Permeable Backsheet." This invention provides backsheets that combine desirable liquid barrier properties with air permeability. The design includes outermost spunbond layers and multiple fine-fiber containing nonwoven layers. Another application is for "Metalizing Materials," which involves metalized materials that consist of a substrate, a metal coating layer, and a transparent coating layer. This invention also includes peelable metalized materials, which feature a removable carrier layer adjacent to the transparent coating layer. Methods for creating these materials are also part of his innovative work.

Conclusion

Dong Wu is a promising inventor in the biomedical engineering sector, with a focus on developing advanced materials. His latest patent applications reflect his commitment to innovation and the potential for future contributions to the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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