Location History:
- Daejon, KR (2010)
- Daejeon, KR (2016 - 2021)
Company Filing History:
Years Active: 2010-2021
Title: Innovations by Dong-Wan Ryoo
Introduction
Dong-Wan Ryoo is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of technology, particularly in the areas of 3D modeling and terrain information processing. With a total of 5 patents to his name, Ryoo continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is a "Method and apparatus for matching 3-dimensional terrain information using heterogeneous altitude aerial images." This invention discloses a method for matching 3D terrain information based on aerial images captured at different altitudes. The process involves receiving a high-altitude numerical height model and low-altitude 3D terrain information, generating a low-altitude numerical height model, and measuring the cross-correlation between the two models to output georeferenced 3D terrain information.
Another notable patent is the "Apparatus for reconstructing 3D model and method for using the same." This invention includes an image acquisition unit that captures multi-view images using drones, a geometric calibration unit for estimating motion variables, and a 3D model creation unit that reconstructs a 3D model of a dynamic object from the matched images.
Career Highlights
Dong-Wan Ryoo is affiliated with the Electronics and Telecommunications Research Institute, where he applies his expertise in developing innovative technologies. His work has garnered attention for its practical applications in various fields, including mapping and modeling.
Collaborations
Ryoo has collaborated with notable colleagues such as Kyung-Kyu Kang and Jung-Jae Yu, contributing to advancements in their respective areas of research.
Conclusion
Dong-Wan Ryoo's contributions to technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative methods for terrain information processing and 3D modeling continue to influence advancements in technology.