Company Filing History:
Years Active: 1998
Title: The Innovative Contributions of Dong Vo
Introduction
Dong Vo is a notable inventor based in Garden Grove, California. He has made significant contributions to the field of electrostatic technology, particularly with his innovative designs that enhance the functionality and safety of electrostatic chucks.
Latest Patents
Dong Vo holds a patent for a "Puncture-resistant electrostatic chuck with flat surface and method of making the same." This invention features a conductive layer, such as copper foil, laminated to a first insulation layer made of polyimide. The design includes a puncture-resistant layer composed of random or woven fibers held together by resin, which provides an uneven topography on its surface. A second insulation layer is placed over this puncture-resistant layer, ensuring a substantially flat top surface achieved through careful lamination with a polished mandrel.
Career Highlights
Dong Vo is currently employed at Packard Hughes Interconnect Company, where he applies his expertise in electrostatic technology. His work focuses on developing advanced solutions that improve the performance and durability of electronic components.
Collaborations
Throughout his career, Dong Vo has collaborated with talented individuals such as Haim Feigenbaum and Bao Le. These partnerships have contributed to the advancement of innovative technologies in their field.
Conclusion
Dong Vo's contributions to the field of electrostatic technology exemplify his commitment to innovation and excellence. His patent for a puncture-resistant electrostatic chuck showcases his ability to solve complex engineering challenges.