This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Dong-Ki Ho: Innovator in Semiconductor Packaging
Introduction
Dong-Ki Ho is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances manufacturing processes.
Latest Patents
Dong-Ki Ho holds a patent for a semiconductor package and method of manufacturing the same. This patent describes a semiconductor package that includes a first package and a second package. It features a connection terminal located between the first and second packages, which includes a first solder ball and a second solder ball that are vertically stacked. Additionally, the package incorporates a solder passivation layer that coats the surface of at least one of the solder balls. A ring-shaped short prevention part surrounds the coupling portion between the first and second solder balls. This innovative design aims to improve the reliability and efficiency of semiconductor packages.
Career Highlights
Dong-Ki Ho is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals in the field. His contributions have been instrumental in advancing semiconductor technology.
Collaborations
Dong-Ki Ho has worked closely with his coworker, Boseong Kim, on various projects. Their collaboration has fostered innovation and has led to the successful development of new technologies in semiconductor packaging.
Conclusion
Dong-Ki Ho is a notable inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative designs and collaborations continue to drive advancements in technology.