Hwaseong-si, South Korea

Dong-Ju Jang


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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4 patents (USPTO):Explore Patents

Title: The Innovations of Dong-Ju Jang

Introduction

Dong-Ju Jang is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in developing advanced semiconductor packages.

Latest Patents

One of Dong-Ju Jang's latest patents is focused on a semiconductor package and a method of fabricating the same. This innovative semiconductor package includes a first package and a second package positioned on top of the first. The second package comprises a second package substrate, first and second semiconductor chips, and a second molding part that covers the semiconductor chips. Additionally, there is a fill part located between the first and second packages, which features a first through hole penetrating the second package substrate and a second through hole that connects to the first through hole. The fill part also includes an extension that is disposed in both through holes, enhancing the overall functionality of the semiconductor package.

Career Highlights

Throughout his career, Dong-Ju Jang has been recognized for his innovative approaches to semiconductor design and fabrication. His work has not only advanced the technology but has also contributed to the efficiency and performance of semiconductor devices in various applications.

Collaborations

Dong-Ju Jang has collaborated with notable colleagues, including Jongho Park and Seung Hwan Kim. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Dong-Ju Jang's contributions to semiconductor technology exemplify the spirit of innovation and collaboration in the field. His patents reflect a commitment to advancing technology and improving the functionality of semiconductor packages.

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