Namyangju, South Korea

Dong Gyu Kim

This inventor holds 1 USPTO granted patent. Top assignee: Korea University Research and Business Foundation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Gyu Kim. Retrieved from https://idiyas.com/inventor/dong-gyu-kim-9pb55lta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Dong Gyu Kim: Inventor of a Multiaxial Strain Sensor.

Introduction

Dong Gyu Kim is an inventor associated with Namyangju, South Korea, and the Korea University Research and Business Foundation. His patent work includes a strain sensor designed to detect deformation along two perpendicular axes.

Latest Patents

The available information identifies one patent associated with Kim: “Strain Sensor and Method of Fabricating the Same.” The invention describes a sensor built on a flexible insulating substrate, with separate X-axis and Y-axis sensors arranged orthogonally to measure strain in each direction. Both sensors use a metal-insulator heterostructure. The design also includes a metal electrode on an area without either sensor and an encapsulation layer covering the sensors and electrode. The disclosed method addresses fabrication of this sensor structure.

Career Highlights

Kim’s listed patent activity centers on flexible sensing technology. The patent record provided associates him with 1 patent and identifies the Korea University Research and Business Foundation as his organization.

Collaborations

The listed coworkers associated with Kim are Soong Ju Oh and Woo Seok Lee.

Conclusion

Dong Gyu Kim’s documented invention focuses on a flexible, two-axis strain sensor that combines orthogonal sensing elements with a metal-insulator structure and protective encapsulation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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