Dong Gun Kam

Title: Dong Gun Kam: Innovator in RF Package Module Technology

Introduction

Dong Gun Kam is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of radio frequency technology, particularly in the development of RF package modules for electronic devices. His innovative work has been recognized through his patent, which showcases his expertise in millimeter wave 5G mobile communication systems.

Latest Patents

Dong Gun Kam holds a patent for an RF package module and an electronic device comprising this module. The patent, identified as No. GK17N0100, relates to research conducted in 2017 under the 'Cross-Departmental Giga KOREA Project,' which was funded by the Ministry of Science and ICT. The RF package module includes a sub-module featuring a Radio Frequency Integrated Chip (RFIC), an antenna designed for wireless signal transmission and reception, and a multi-layer circuit board that facilitates signal transfer between the RFIC and the antenna.

Career Highlights

Throughout his career, Dong Gun Kam has worked with notable organizations, including Samsung Electronics and the Ajou University Industry-Academic Cooperation Foundation. His experience in these institutions has allowed him to collaborate with leading experts in the field and contribute to cutting-edge research and development projects.

Collaborations

Some of his notable coworkers include Kwang-Hyun Baek and Sangwook Park. Their collaborative efforts have further advanced the research and development of RF technologies.

Conclusion

Dong Gun Kam's contributions to the field of RF technology and his innovative patent demonstrate his commitment to advancing mobile communication systems. His work continues to influence the development of electronic devices in the rapidly evolving tech landscape.