The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Dec. 06, 2017
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ajou University Industry-academic Cooperation Foundation, Suwon-si, KR;
Kwang-Hyun Baek, Hwaseong-si, KR;
Sangwook Park, Suwon-si, KR;
Dong Gun Kam, Suwon-si, KR;
Young-ju Lee, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ajou University Industry-Academic Cooperation Foundation, Suwon-si, KR;
Abstract
The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the 'Cross-Departmental Giga KOREA Project' funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.