Shanghai, China

Dong Cheng

This inventor holds 1 USPTO granted patent. Top assignee: China Unionpay Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Cheng. Retrieved from https://idiyas.com/inventor/dong-cheng-613ic67l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Dong Cheng

Introduction: Dong Cheng is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of model training through his innovative patent. His work focuses on improving the accuracy of model training, which is crucial in various technological applications.

Latest Patents: Dong Cheng holds a patent for a "Model gradient update method and device." This invention provides a method for enhancing the accuracy of model training. The process involves a central server executing a gradient update repeatedly until a stop condition is met. It includes receiving first gradients from multiple nodes, obtaining a second gradient based on these first gradients, and sending the second gradient back to the nodes.

Career Highlights: Dong Cheng is associated with China UnionPay Co., Ltd., where he applies his expertise in model training and gradient updates. His work has been instrumental in advancing the capabilities of machine learning and artificial intelligence.

Collaborations: Throughout his career, Dong Cheng has collaborated with notable colleagues, including Xin Cheng and Yongkai Zhou. These collaborations have fostered a productive environment for innovation and development in their respective fields.

Conclusion: Dong Cheng's contributions to model training through his patented methods highlight his role as a key innovator in the technology sector. His work continues to influence advancements in machine learning and artificial intelligence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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