Donald T Campbell

Title: Innovations of Donald T. Campbell

Introduction

Donald T. Campbell is a notable inventor based in Campbell, California. He has made significant contributions to the field of technology, particularly in the area of solder bumping and deposition methods. With a total of 4 patents to his name, Campbell's work has had a considerable impact on manufacturing processes.

Latest Patents

Among his latest patents is a method of bumping substrates by contained paste deposition. This innovative technique allows for the stenciling of solder bumps onto substrates, achieving pitches below 400 microns. The solder is applied through a stencil/mask and paste method, with the mask remaining attached to the substrate during reflow. Additionally, pitches greater than 400 microns can also be obtained through this invention. Another significant patent is the method of making solder balls by contained paste deposition, which shares similar features and benefits as the previous method, ensuring the generation of uniform and controllable volume metal balls.

Career Highlights

Donald T. Campbell is currently associated with Hewlett-Packard Company, where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing the capabilities of soldering technology, which is crucial for various electronic applications.

Collaborations

Throughout his career, Campbell has collaborated with talented individuals such as Matthew K. Schwiebert and Matthew Heydinger. These collaborations have further enhanced the quality and scope of his inventions.

Conclusion

Donald T. Campbell's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative methods in solder bumping and deposition continue to influence the industry positively.