Donald P Rearick

Title: Innovations by Donald P Rearick

Introduction

Donald P Rearick is a notable inventor based in Shokan, NY (US), recognized for his contributions to thermal management technologies. He holds three patents that showcase his innovative approach to enhancing the efficiency of electronic equipment.

Latest Patents

One of his latest patents is the "Composite liquid cooled plate for electronic equipment." This invention features a heat transfer plate, preferably made of copper, positioned on one or both sides of a core, which is typically plastic. The core is designed with flow channels that direct water against the heat transfer plates, effectively reducing thermal resistance in high-heat areas. This design maintains a lightweight assembly by limiting the use of copper or other conductive materials to only the necessary areas.

Another significant patent is the "Ceramic base component packaging assembly." This assembly is engineered for high thermal transfer rates and includes a molded plastic cover that accommodates spring washers, ceramic pads, resistive elements, and other electronic components. The thermally conductive ceramic base ensures effective thermal conduction while also serving as an electrical isolator for the device.

Career Highlights

Donald P Rearick is associated with International Business Machines Corporation (IBM), where he has made significant strides in the field of thermal management for electronic devices. His work has contributed to advancements in the efficiency and performance of various electronic systems.

Collaborations

Throughout his career, Rearick has collaborated with notable colleagues, including Eric P Lovgren and Clifford B Wells, who have also contributed to the field of electronic engineering.

Conclusion

Donald P Rearick's innovative patents reflect his commitment to improving thermal management in electronic equipment. His work continues to influence the industry and enhance the performance of electronic devices.