San Diego, CA, United States of America

Donald O Nelepovitz

This inventor holds 2 USPTO granted patents. Top assignees: Hyperform Technologies, Inc., Rohr, Inc.. Active years: 1993-1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald O Nelepovitz. Retrieved from https://idiyas.com/inventor/donald-o-nelepovitz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 1993-1998

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2 patents (USPTO):Explore Patents

Title: Innovations of Donald O Nelepovitz

Introduction

Donald O Nelepovitz is a notable inventor based in San Diego, CA. He holds 2 patents that showcase his contributions to the field of engineering and materials science. His work primarily focuses on advanced manufacturing techniques and high-temperature bonding methods.

Latest Patents

One of his latest patents is titled "Superplastic metalforming with self-contained die." This innovative method utilizes a self-contained die that eliminates the need for external containment bands or rings. The die is particularly beneficial for forming generally planar parts, but it can also accommodate more cylindrical shapes. The design includes multiple die segments made from materials such as graphite or ceramic, which interlock through a connecting portion. The process involves heating a gas-tight preform assembly made of titanium alloy in a vacuum furnace, allowing gas to expand the assembly to fit the die's shape. Upon cooling, the finished part is separated from the assembly.

Another significant patent is the "Differential pressure method and apparatus for bonding high temperature." This invention provides a method for bonding high-temperature structures, such as face sheets to honeycomb cores, using differential gas pressure. A high-temperature resistant foil sheet is welded to a support to create a vacuum bag around the structure. The bonding occurs in a vacuum furnace, where the assembly is heated to the bonding temperature while maintaining a vacuum. The process ensures that the components are tightly bonded, particularly suitable for metals like titanium or Inconel.

Career Highlights

Throughout his career, Donald has worked with reputable companies such as Rohr, Inc. and Hyperform Technologies, Inc. His experience in these organizations has contributed to his expertise in advanced manufacturing processes.

Collaborations

Donald has collaborated with notable professionals in his field, including John J Anderson and Ken Schertzer. Their collective efforts have furthered innovations in high-temperature bonding and metal forming techniques.

Conclusion

Donald O Nelepovitz's contributions to the field of engineering through his patents reflect his innovative spirit and dedication to advancing manufacturing technologies. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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