Wheeling, IL, United States of America

Donald L Denney, Jr

This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald L Denney, Jr. Retrieved from https://idiyas.com/inventor/donald-l-denney-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Donald L Denney, Jr.

Introduction

Donald L Denney, Jr. is a notable inventor based in Wheeling, IL (US). He has made significant contributions to the field of electrical engineering, particularly in the cooling of electronic components. His innovative approach has led to the development of a unique apparatus that enhances the performance and longevity of electronic devices.

Latest Patents

Denney holds a patent for an "Apparatus and method for cooling an electrical component." This invention features a flexible printed wiring device that includes a region designed to accommodate an electronic component. The device incorporates a channel with an inlet and outlet, allowing fluid to be directed toward the electronic component, ensuring efficient cooling through direct contact.

Career Highlights

Throughout his career, Denney has been associated with Motorola Corporation, where he has applied his expertise in electrical engineering. His work has contributed to advancements in technology, particularly in the design and functionality of electronic devices.

Collaborations

Denney has collaborated with various professionals in his field, including Martinho Rabindra Pais, to further enhance the development of innovative technologies.

Conclusion

Donald L Denney, Jr. exemplifies the spirit of innovation in the electrical engineering sector. His contributions, particularly in cooling electronic components, have paved the way for improved technology and efficiency in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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