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For the Inventor, By the Inventor

Montrose, PA, United States of America

Donald I Mead

USPTO Granted Patents = 9

Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 57(Granted Patents)


Company Filing History:

goldMedal9 out of 164,219 
 
International Business Machines Corporation
 patents

Years Active: 1998-2006

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9 patents (USPTO):Explore Patents
1. 7101782 - Method of making a circuitized substrate (2006-09-05),
2. 7037819 - Method of making a circuitized substrate (2006-05-02),
3. 6818988 - Method of making a circuitized substrate and the resultant circuitized substrate (2004-11-16),
4. 6524888 - Method of attaching a conformal chip carrier to a flip chip (2003-02-25),
5. 6513701 - Method of making electrically conductive contacts on substrates (2003-02-04),
6. 6337509 - Fixture for attaching a conformal chip carrier to a flip chip (2002-01-08),
7. 6173887 - Method of making electrically conductive contacts on substrates (2001-01-16),
8. 5941449 - Method of making an electronic package having spacer elements (1999-08-24),
9. 5762258 - Method of making an electronic package having spacer elements (1998-06-09),

Title: The Innovative Contributions of Donald I. Mead

Introduction

Donald I. Mead is a notable inventor based in Montrose, PA (US), recognized for his significant contributions to the field of electronic packaging. With a total of 9 patents to his name, Mead has made strides in developing advanced technologies that enhance the functionality and efficiency of electronic devices.

Latest Patents

One of Mead's latest patents is a method of making a circuitized substrate. This innovative circuitized substrate includes a substrate with a conductive pad, a first layer of solder enhancing material, and a solder member positioned strategically to improve the substrate's performance. The design allows for the fabrication of electronic packages, showcasing Mead's expertise in electronic engineering and materials science.

Career Highlights

Throughout his career, Donald I. Mead has been associated with the International Business Machines Corporation (IBM), where he has contributed to various projects that push the boundaries of technology. His work has not only advanced the field but has also paved the way for future innovations in electronic packaging.

Collaborations

Mead has collaborated with several talented individuals, including Timothy A. Gosselin and Mark Vincent Pierson. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Donald I. Mead's contributions to the field of electronic packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic solutions.

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