Company Filing History:
1 out of 832,891 Years Active: 2002
Title: Innovations in Soldering by Donald H Avery
Introduction
Donald H Avery is an accomplished inventor based in Poulsbo, WA (US). He has made significant contributions to the field of soldering methods and compositions, which are crucial for creating reliable electrical connections in electronic devices. His innovative approach aims to enhance the performance and durability of solder joints, reducing the likelihood of failures.
Latest Patents
Donald H Avery holds 1 patent for his work on soldering methods and compositions. His patent discloses techniques that provide electrical connections between surfaces while minimizing the risk of short circuits and solder-starved joints. The invention employs two-component solder compositions that form "metallic foam" joints upon heating. This method utilizes bimetallic particles that fuse rapidly, significantly reducing the chances of reflow-related solder joint faults. The porous nature of the solder joints alleviates plastic constraints, thereby lowering the average tensile joint stress and enhancing the reliability of electronic devices.
Career Highlights
Throughout his career, Donald H Avery has focused on developing advanced soldering techniques that address common issues faced in electronic manufacturing. His innovative solder compositions are designed to withstand thermal cycling, which is essential for maintaining the integrity of solder joints in various applications. His work has the potential to reduce the use of lead and other toxic components in solder, contributing to more environmentally friendly manufacturing practices.
Collaborations
Donald H Avery has collaborated with John Paul Ranieri, working together to advance the field of soldering technologies. Their partnership has fostered the development of innovative solutions that enhance the performance of electronic connections.
Conclusion
Donald H Avery's contributions to soldering methods and compositions represent a significant advancement in the field of electronics. His innovative techniques not only improve the reliability of solder joints but also promote environmentally sustainable practices in manufacturing.