Company Filing History:
9 out of 335 
1 out of 1,302 
Years Active: 1983-1987
Title: Innovations by Donald E Cousens: A Trailblazer in Bonding Technologies
Introduction
Donald E Cousens, an accomplished inventor based in Saco, ME, has made significant contributions to the field of bonding technologies. With a remarkable portfolio of 10 patents, his innovations have helped enhance the efficiency and effectiveness of lead wire bonding in integrated circuits.
Latest Patents
Among his notable inventions, two recent patents stand out. The first, titled "Apparatus for feeding bonding wire," describes an innovative mechanism for maintaining and delivering a slack reserve length of lead wire. This apparatus features a slack chamber that keeps the wire untangled and in a desired configuration using pressurized airflow. Wire sensors work in tandem with control logic to ensure an optimal reserve length is maintained.
The second patent, "Variation and control of bond force," presents a lead wire bonding machine designed for enhanced ball bonding and wedge bonding processes. This invention utilizes a variable linear drive to apply precise bond forces, which can be varied according to specific requirements. A wave form generator allows for modulation of the bond force to adapt to different materials and bonding sites, thus enabling a higher quality of bonding across various applications.
Career Highlights
Throughout his career, Donald has worked with influential companies such as Fairchild Camera and Instrument Corporation and Fairchild Semiconductor Corporation. His experiences in these organizations have empowered him to develop his groundbreaking innovations, pushing the boundaries of technology in the bonding field.
Collaborations
Throughout his career, Donald has collaborated with skilled professionals like John A Kurtz and Mark D Dufour. Their work together has fostered inventive solutions that have advanced the industry standards in bonding technology.
Conclusion
Donald E Cousens stands out as a pioneering inventor whose patents reflect a dedication to enhancing lead wire bonding processes. His innovative contributions continue to shape the technological landscape, showcasing the importance of creativity and collaboration in driving progress within the field.