Company Filing History:
Years Active: 2000-2003
Title: Don Stimpson: Innovator in High Density Arrays
Introduction
Don Stimpson is a notable inventor based in Garland, TX (US). He has made significant contributions to the field of high-density arrays, holding a total of 3 patents. His innovative work focuses on methods that enhance the production and testing of various compounds.
Latest Patents
One of his latest patents is titled "Parallel production of high density arrays." This invention provides an array bundle designed for creating multiple arrays for testing. The array bundle can be cut transversely to form a series of identical arrays of cells. In one embodiment, this array bundle is utilized for detecting predetermined components from sample mixtures. Another patent under the same title describes a method to produce arrays of compounds for concurrent testing. Two formats are presented, utilizing porous rods or porous sheet materials. In one format, the compounds of the array are immobilized onto porous rod elements. In the second format, the compounds are immobilized as lines on a sheet of porous material. In both cases, a bundle is formed by radial compression of the rods or spiral wrapping of the sheet. A sheath is applied to the bundle, and arrays are cut as slabs. Each synthesis or application step to create an array element is used to fabricate multiple arrays. This method allows for the production of relatively high-density arrays using current printing technologies and is particularly suited for mass production.
Career Highlights
Throughout his career, Don Stimpson has worked with various companies, including Unitec Co., Ltd. His experience in the industry has contributed to his expertise in developing innovative solutions for high-density array production.
Collaborations
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Conclusion
Don Stimpson's contributions to the field of high-density arrays demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of production methods that can significantly impact testing processes.