Don J Thielman

Title: Don J Thielman: Innovator in Multichip Module Technology

Introduction

Don J Thielman is a notable inventor based in Bailey, Colorado. He has made significant contributions to the field of electronics through his innovative work on multichip modules. His expertise and creativity have led to the development of technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Thielman holds a patent for a multichip module that utilizes low temperature co-fired ceramic (LTCC) technology. This invention is designed to provide high-density interconnects between electronic elements. The ceramic carrier features multiple cavities that accommodate various submodules, which are constructed to hold different circuit elements. These circuit elements are attached on one side of the submodule, while electrical contacts are provided on the opposite side. When installed into the carrier module, the submodule is flipped to expose the electrical connections. A layer of flex circuitry is then applied over the submodule and the ceramic carrier to establish electrical connections between the submodules and external components.

Career Highlights

Thielman is currently employed at Lockheed Martin Corporation, where he continues to work on advanced technologies in the field of electronics. His role at the company allows him to collaborate with other talented professionals and contribute to innovative projects that push the boundaries of technology.

Collaborations

One of Thielman's notable coworkers is David M Barnett. Together, they work on various projects that aim to improve electronic systems and components.

Conclusion

Don J Thielman's contributions to multichip module technology exemplify his dedication to innovation in electronics. His patent and work at Lockheed Martin Corporation highlight his role as a key figure in advancing electronic interconnect technology.