Company Filing History:
Years Active: 2015
Title: The Innovative Mind of Dominique Marais
Introduction
Dominique Marais is a notable inventor based in La Terrasse, France. He has made significant contributions to the field of electronics, particularly with his innovative patent that enhances electronic packaging technology. His work is recognized for its complexity and utility in modern electronic devices.
Latest Patents
Dominique holds a patent for a "Dual side package on package." This invention involves an electronic package that includes a substrate wafer with an interconnect network. A first chip is fixed to the front of the substrate, connected to the interconnect network, and encapsulated by a body. A second chip is placed on the back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and the front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material. This patent showcases his innovative approach to improving electronic packaging.
Career Highlights
Dominique Marais is associated with STMicroelectronics (Grenoble 2) SAS, where he has been instrumental in developing advanced electronic solutions. His work has contributed to the company's reputation as a leader in semiconductor technology. With a focus on innovation, he continues to push the boundaries of what is possible in electronic design.
Collaborations
Dominique has collaborated with talented coworkers such as Jacques Chavade and Rémi Brechignac. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Dominique Marais is a distinguished inventor whose work in electronic packaging has made a significant impact on the industry. His innovative patent and collaborations highlight his commitment to advancing technology. His contributions will continue to influence the future of electronics.