Company Filing History:
Years Active: 2018
Title: Innovations by Domingo Jr Maggay
Introduction
Domingo Jr Maggay is a notable inventor based in Bulacan, Philippines. He has made significant contributions to the field of semiconductor technology, particularly in the design of wafer level chip scale packages. His innovative approach has led to the development of solutions that address stress relief in large copper plane designs.
Latest Patents
Domingo Jr Maggay holds a patent for "Stress relief solutions on WLCSP large/bulk copper plane design." This patent describes a wafer level chip scale package that includes at least one redistribution layer connected to a wafer through an opening in a first polymer layer. The design features a roughened top surface on the redistribution layer and strategically placed holes to enhance adhesion and cohesion between layers, promoting improved performance in semiconductor applications.
Career Highlights
Domingo Jr Maggay is currently employed at Dialog Semiconductor (UK) Limited, where he continues to innovate in the semiconductor industry. His work focuses on enhancing the reliability and efficiency of chip designs, contributing to advancements in technology.
Collaborations
He collaborates with talented professionals such as Ian Kent and Rajesh Subraya Aiyandra, who share his commitment to innovation and excellence in their field.
Conclusion
Domingo Jr Maggay's contributions to semiconductor technology through his patent and work at Dialog Semiconductor highlight his role as a key innovator in the industry. His efforts continue to pave the way for advancements in chip design and functionality.