Seoul, South Korea

Do Wook Kim

This inventor holds 3 USPTO granted patents. Top assignees: Daeyoung Packaging Co., Ltd., Dae Young Packing Co., Ltd.. Active years: 1995-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Do Wook Kim. Retrieved from https://idiyas.com/inventor/do-wook-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.5

ph-index = 3

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 1995-2000

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3 patents (USPTO):Explore Patents

Title: The Innovations of Do Wook Kim

Introduction

Do Wook Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of packaging technology, particularly in the production of corrugated paperboard. With a total of 3 patents to his name, Kim's work has had a meaningful impact on the industry.

Latest Patents

Kim's latest patents include a "Method and apparatus for producing multi-ply corrugated paperboard" and "Double-ply corrugated paperboard." These innovations showcase his expertise in enhancing the efficiency and quality of packaging materials.

Career Highlights

Throughout his career, Do Wook Kim has worked with prominent companies such as Daeyoung Packaging Co., Ltd. and Dae Young Packing Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the advancement of packaging solutions.

Collaborations

Kim has collaborated with fellow inventor Ki Jeong Kim, further expanding his network and influence in the field of packaging technology.

Conclusion

Do Wook Kim's innovative spirit and dedication to improving packaging technology have established him as a respected figure in the industry. His contributions continue to shape the future of corrugated paperboard production.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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