Chachoengsao, Thailand

Do Sung Chun


Average Co-Inventor Count = 5.0

ph-index = 6

Forward Citations = 164(Granted Patents)


Location History:

  • Chacheongsao, TH (2003 - 2007)
  • Chacheongsao, KR (2004 - 2007)
  • Tempe, AZ (US) (2008)

Company Filing History:


Years Active: 2003-2008

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7 patents (USPTO):Explore Patents

Title: Do Sung Chun: Innovator in Semiconductor Packaging

Introduction

Do Sung Chun is a prominent inventor based in Chachoengsao, Thailand. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on developing innovative solutions that enhance the efficiency and performance of semiconductor devices.

Latest Patents

One of his latest patents is titled "Semiconductor package and method for fabricating the same." This invention discloses semiconductor packages that feature a thin structure, which allows for efficient heat dissipation from the semiconductor chip. The design includes a semiconductor chip with multiple input/output pads, a circuit board with a resin substrate, and electrical conductors that connect the chip to the circuit board. The encapsulation of the semiconductor chip and the use of conductive balls further enhance the package's functionality.

Another notable patent is for a "Thin semiconductor package including stacked dies." This invention describes a semiconductor package that incorporates at least two semiconductor chips stacked within an opening of a circuit board. The design ensures that the chips are protected from external environments while maintaining effective electrical connections through bond fingers and conductive balls.

Career Highlights

Do Sung Chun is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging solutions. His expertise in the field has led to numerous advancements in semiconductor technology, making him a valuable asset to his organization.

Collaborations

He has collaborated with notable coworkers, including Won Sun Shin and Vincent DiCaprio, contributing to various projects that push the boundaries of semiconductor innovation.

Conclusion

Do Sung Chun's work in semiconductor packaging exemplifies the importance of innovation in technology. His patents reflect a commitment to improving the efficiency and performance of semiconductor devices, making a lasting impact in the industry.

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