Company Filing History:
Years Active: 2010
Title: Recognizing Dluong Ngan Leong: Innovator in Semiconductor Technology
Introduction
Dluong Ngan Leong is a promising inventor based in Negeri Sembilan, Malaysia. With a keen focus on enhancing thermal dissipation in semiconductor technology, her contributions stand out in the competitive field of electronics. Leong's innovative approach has led to the development of a significant patented invention that addresses critical challenges in semiconductor packaging.
Latest Patents
Dluong Ngan Leong holds a patent titled "Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics." This invention presents an advanced packaged device that includes a semiconductor chip oriented specifically to improve heat dissipation. The design features a major current-carrying electrode that faces the top of the package, along with a conductive clip to couple the electrode to the next level of assembly. Additionally, the inclusion of a heat spreader device, either formed on or integrated with the conductive clip, significantly enhances the device's thermal management capabilities, ensuring optimal performance during operation.
Career Highlights
Leong is currently a part of Semiconductor Components Industries, LLC, where her expertise contributes to the advancement of semiconductor solutions. Her patent highlights her innovative thinking and dedication to improving electronic components' functionality and efficiency. The impact of her work extends across various applications in electronics, where effective thermal management is crucial.
Collaborations
Throughout her career, Dluong Ngan Leong has collaborated with talented professionals such as Francis J Carney and Michael John Seddon. These collaborations have fostered an environment of innovation and creativity, allowing her to leverage diverse expertise in the development of her cutting-edge semiconductor technology.
Conclusion
Dluong Ngan Leong continues to make significant strides in the field of semiconductor technology. Her patented inventions and collaborations exemplify her commitment to innovation and excellence. As she advances her career, the contributions of Leong are expected to have a lasting impact on the electronics industry, paving the way for future developments in heat dissipation and semiconductor packaging.