The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Dec. 20, 2004
Francis J. Carney, Gilbert, AZ (US);
Michael J. Seddon, Gilbert, AZ (US);
Kent L. Kime, Phoenix, AZ (US);
Dluong Ngan Leong, Negeri Sembilan, MY;
Yeu Wen Lee, Negeri Sembilan, MY;
Francis J. Carney, Gilbert, AZ (US);
Michael J. Seddon, Gilbert, AZ (US);
Kent L. Kime, Phoenix, AZ (US);
Dluong Ngan Leong, Negeri Sembilan, MY;
Yeu Wen Lee, Negeri Sembilan, MY;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed.