Harbin, China

Dixin Sha

This inventor holds 1 USPTO granted patent. Top assignee: Institute of Food Processing, Haas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dixin Sha. Retrieved from https://idiyas.com/inventor/dixin-sha

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dixin Sha and Microwave-Induced Cracking for Easy-to-Cook Whole Grains.

Introduction

Dixin Sha is an inventor associated with Harbin, China, and the Institute of Food Processing, Haas. His work includes a food-processing invention designed to make whole grains easier to cook while retaining their complete-grain form.

Latest Patents

Sha is associated with 1 patent: “Preparation Method of Easy-to-Cook Whole Grain Based on Microwave-Induced Cracking.” The method applies heat-moisture treatment to whole grains, followed by short-time microwave-induced cracking, tempering, and cooling. The resulting grains remain intact, expand slightly, and develop fine surface cracks. During rice steaming, their water absorption increases from 1.35 times to 1.9 times the original weight of unprocessed whole grains.

Career Highlights

The patent addresses a practical challenge in food processing: improving the cooking properties of whole grains without breaking them apart. Its sequence of moisture and heat treatment, microwave processing, tempering, and cooling is intended to increase water absorption and support easier cooking.

Collaborations

Sha’s listed coworkers include Shuwen Lu and Chuanying Ren. The patent information also associates him with the Institute of Food Processing, Haas.

Conclusion

Dixin Sha’s patent presents a microwave-based approach to preparing intact whole grains that absorb more water during steaming and are designed to cook more easily.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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