Sunbury On Thames, United Kingdom

Dipen Rai

This inventor holds 1 USPTO granted patent. Top assignee: Outdoor Wireless Networks LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dipen Rai. Retrieved from https://idiyas.com/inventor/dipen-rai-n66oq4w6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dipen Rai and Wind Turbine Mounting Technology.

Introduction

Dipen Rai is an inventor based in Sunbury-on-Thames, United Kingdom. His patent work includes a design for integrating wind turbines with telecommunications structures. He is associated with Outdoor Wireless Networks LLC and has 1 patent listed in the information provided.

Latest Patents

Rai is named on “Wind Turbine Mounting Kits for Telecommunication Structures and Related Assemblies.” The patent describes an antenna assembly with multiple antennas and wind turbines mounted on a telecommunications structure. The turbines are positioned below the antennas, and the application also describes mounting kits for attaching wind turbines to telecommunications structures.

Career Highlights

The invention addresses the mounting of small wind turbines on telecommunications infrastructure, combining power-generation equipment with structures that support antennas. The patent identifies Rai’s work in this area of telecommunications-related engineering.

Collaborations

Rai’s listed coworkers include Steven M. Clark and Lokeshwaran Maruthanayagam Sundar. His association with Outdoor Wireless Networks LLC provides the organizational context for the patent information supplied.

Conclusion

Dipen Rai’s listed patent focuses on mounting wind turbines below antennas on telecommunications structures, reflecting an approach to integrating renewable-energy equipment with communications infrastructure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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