Pune, India

Dipak Tathe

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dipak Tathe. Retrieved from https://idiyas.com/inventor/dipak-tathe-z1v3jp31

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Dipak Tathe

Introduction

Dipak Tathe is a notable inventor based in Pune, India. He has made significant contributions to the field of adhesive technology. His work focuses on developing advanced adhesive systems that enhance performance and usability.

Latest Patents

Dipak Tathe holds a patent for a two-part cyanoacrylate curable adhesive system. This innovative adhesive system combines cyanoacrylate and cationically curable components, providing enhanced bonding capabilities. His patent is a testament to his expertise and commitment to advancing adhesive technology. He has 1 patent to his name.

Career Highlights

Dipak Tathe is currently employed at Henkel AG & Company, KGaA, a leading global company in adhesive solutions. His role at Henkel allows him to work on cutting-edge projects that push the boundaries of adhesive applications. His contributions have been instrumental in developing products that meet the evolving needs of various industries.

Collaborations

Some of his notable coworkers include Aine Mooney and Jayesh P Shah. Their collaboration fosters a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Dipak Tathe's work exemplifies the spirit of innovation in adhesive technology. His contributions, particularly in developing advanced adhesive systems, highlight his role as a key inventor in the industry. His ongoing efforts continue to shape the future of adhesive applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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