This inventor holds 1 USPTO granted patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Diong Hing Ding: Semiconductor Manufacturing Innovation
Introduction
Diong Hing Ding is an inventor associated with Penang, Malaysia, and Advanced Micro Devices Corporation. His patent work addresses a manufacturing challenge in flip-chip semiconductor assembly: controlling moisture during solder reflow to help minimize flux residue.
Latest Patents
The provided information lists one patent for Ding: “Minimizing Flux Residue by Controlling Amount of Moisture During Reflow.” The invention describes attaching a semiconductor die to a substrate with solder, applying no-clean flux, and heating the materials in a furnace before underfilling the space between the die and substrate. During heating, the furnace’s reducing atmosphere is monitored for moisture content, and a signal is provided if that content exceeds a specified threshold. The disclosure also describes a reflow furnace for carrying out the method.
Career Highlights
Ding’s listed patent focuses on process monitoring in semiconductor manufacturing. By measuring moisture during reflow and signaling when it exceeds a threshold, the method provides a way to manage conditions that can contribute to flux residue.
Collaborations
The supplied information names Maria G. Guardado and Raj N. Master as Ding’s coworkers. It does not specify their roles in the patent or describe their contributions to the invention.
Conclusion
Diong Hing Ding’s listed invention combines moisture monitoring with flip-chip assembly to address flux residue during semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile