Diong H Ding

Title: Diong H Ding: Innovator in Solder Joint Technology

Introduction

Diong H Ding is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronics, particularly in the area of solder joint technology. His innovative methods have the potential to enhance the reliability and performance of electronic packaging.

Latest Patents

Diong H Ding holds a patent for a method for forming solder joints for a flip chip assembly. This method involves creating a solder joint for a package arrangement with a dispersed Sn microstructure. The flip chip is equipped with solder bumps that connect to pads on the package through eutectic solder joints. The process includes a eutectic reflow profile designed to achieve solder joints with evenly distributed Sn grains. This profile features an increased cooling rate and decreased hold time, along with a higher peak temperature. Additionally, a defined ratio of pad openings in the solder mask to the under bump metallurgy is established. These innovations contribute to prolonging the fatigue life of the package arrangement.

Career Highlights

Diong H Ding is currently employed at GlobalFoundries Inc., a leading semiconductor manufacturer. His work focuses on improving solder joint technology, which is crucial for the reliability of electronic devices. His expertise in this area has positioned him as a valuable asset to his company.

Collaborations

Diong has collaborated with several talented individuals, including Raj N Master and Junaida A Bakar. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Diong H Ding's contributions to solder joint technology exemplify the importance of innovation in the electronics industry. His patented methods not only enhance the performance of electronic packaging but also demonstrate the potential for future advancements in this field.