Green Brook, NJ, United States of America

Dinh G Lai

This inventor holds 1 USPTO granted patent. Top assignee: Lucent Technologies Inc.. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dinh G Lai. Retrieved from https://idiyas.com/inventor/dinh-g-lai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Dinh G Lai - Innovator in Fluid Flow Management Systems

Introduction

Dinh G Lai is a notable inventor based in Green Brook, NJ (US). He has made significant contributions to the field of fluid flow management, particularly in enhancing the cooling of circuit packs. His innovative approach has led to the development of a unique system that improves fluid dynamics.

Latest Patents

Dinh G Lai holds a patent for a fluid flow management system. This system is designed to enhance the cooling of a circuit pack by incorporating a bar that extends transverse to the direction of fluid flow. The bar effectively breaks up the otherwise laminar flow into a turbulent flow, thereby improving cooling efficiency.

Career Highlights

Dinh G Lai is associated with Lucent Technologies Inc., where he has applied his expertise in fluid dynamics. His work has been instrumental in advancing technologies that require efficient cooling solutions.

Collaborations

Throughout his career, Dinh G Lai has collaborated with notable colleagues, including Thomas Francis Craft, Jr. and Charles E Johnson. These collaborations have contributed to the development of innovative solutions in their respective fields.

Conclusion

Dinh G Lai's contributions to fluid flow management systems exemplify the impact of innovative thinking in technology. His patent and work at Lucent Technologies Inc. highlight his role as a key inventor in enhancing cooling solutions for circuit packs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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