Guangzhou City, China

Ding-Yong Zeng

This inventor holds 1 USPTO granted patent. Top assignees: Nextronics Engineering Corp., Nextronics ENGINEERING(GUANGDONG) Corp.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ding-Yong Zeng. Retrieved from https://idiyas.com/inventor/ding-yong-zeng-ul3yc0oj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ding-Yong Zeng: Inventor of a Liquid-Cooling Quick Connector

Introduction

Ding-Yong Zeng is an inventor associated with Guangzhou City, China. His patent work includes a liquid-cooling quick connector designed to help prevent accidental unlocking during use.

Latest Patents

Zeng is associated with 1 patent: “Liquid-Cooling Quick Connector Device.” The invention includes first and second connectors that can be joined together. Its locking mechanism has a button body, a movable top button cover, a sliding locking key, and two elastic members. During mating, the button body can move downward without unlocking the locking key. Pressing the top button cover alone does not unlock the connector; the locking key must first be slid and then pressed downward to release it. This design helps prevent accidental unlocking and allows the connectors to mate while a secondary lock is engaged.

Career Highlights

Zeng is associated with Nextronics Engineering Corp. and Nextronics Engineering (Guangdong) Corp. His patented connector design addresses secure mating and release in liquid-cooling systems.

Collaborations

Zeng’s listed coworkers include Chih-hsiung Hsu and Zhi-Hong Deng.

Conclusion

Ding-Yong Zeng’s patent presents a safety-focused quick connector mechanism intended to reduce accidental release while supporting reliable connection in liquid-cooling applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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