Renton, WA, United States of America

Ding Wen Chung

This inventor holds 1 USPTO granted patent. Top assignee: Blue Origin Manufacturing, LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ding Wen Chung. Retrieved from https://idiyas.com/inventor/ding-wen-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Ding Wen Chung and His Ignition-Resistant Coating Patent.

Introduction

Ding Wen Chung is an inventor associated with Renton, Washington, and Blue Origin Manufacturing, LLC. His patent work includes a method for fabricating an ignition-resistant coating system through electrodeposition and thermal processing.

Latest Patents

Chung is credited with 1 patent: “Method of Fabricating an Ignition Resistant Coating System Using Electrodeposition and Thermal Processing.” The invention describes electrodepositing a multilayer coating onto a nickel or nickel-alloy substrate. The layers consist of a first nickel layer, a copper layer, and a second nickel layer. Thermal treatment then diffuses the layers together and metallurgically bonds the coating to the substrate.

Career Highlights

The patent presents a manufacturing approach for creating a bonded, multilayer coating intended to resist ignition. Its combination of electrodeposition and thermal processing is the central feature of the disclosed method. Chung is associated with Blue Origin Manufacturing, LLC.

Collaborations

The provided information identifies David Segletes and Jonathan Johnson as Chung’s coworkers. It does not specify whether they collaborated with him on the patent.

Conclusion

Ding Wen Chung’s patent documents a nickel-and-copper multilayer coating process designed to produce an ignition-resistant coating bonded to its substrate.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…