Company Filing History:
Years Active: 2010-2011
Title: Innovations by Ding Hai in Integrated Capacitors
Introduction
Ding Hai is a notable inventor based in Shanghai, China. He has made significant contributions to the field of integrated capacitors, holding 2 patents that showcase his innovative approach to package-level structures.
Latest Patents
His latest patents include advancements in integrated capacitors in package-level structures, processes of making the same, and systems containing these innovations. One of the key features of his work is an article that includes a top electrode embedded in a solder mask. Additionally, it describes a top electrode positioned on a core structure. The process of forming the top electrode involves reducing the solder mask thickness and subsequently forming the top electrode on the reduced-thickness solder mask. Another aspect of his process includes forming the top electrode over a high-K dielectric that is situated in a patterned portion of the core structure.
Career Highlights
Ding Hai is currently employed at Intel Corporation, where he continues to push the boundaries of technology in his field. His work has been instrumental in developing new methods and systems that enhance the performance of integrated capacitors.
Collaborations
Ding has collaborated with notable coworkers such as John J Tang and Xiang Yin Zeng, contributing to a dynamic and innovative work environment.
Conclusion
Ding Hai's contributions to the field of integrated capacitors reflect his dedication to innovation and excellence. His patents not only advance technology but also pave the way for future developments in the industry.