Ding Feng

Title: The Innovative Contributions of Ding Feng

Introduction

Ding Feng is a notable inventor based in Jincheng, China. He has made significant contributions to the field of technology, particularly in the development of lens modules and dustproof components for electronic devices. With a total of 3 patents to his name, Ding Feng continues to push the boundaries of innovation.

Latest Patents

Ding Feng's latest patents include a lens module and a terminal device. The lens module features a circuit board, a reinforcing plate, a photosensitive chip, and a wire. The design incorporates a through hole in the circuit board, allowing for the accommodation of the photosensitive chip. The reinforcing plate is designed with a protruding portion that fits into the through hole, ensuring a compact and efficient structure. Additionally, the dustproof member he developed includes a base plate, a dustproof plate, and a connecting portion, which forms a dust collecting groove. This innovation enhances the durability and functionality of camera modules and electronic devices.

Career Highlights

Ding Feng has worked with several companies, including Triple Win Technology (Shenzhen) Co., Ltd. and Rayprus Technology (Foshan) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various technological advancements.

Collaborations

Throughout his career, Ding Feng has collaborated with talented individuals such as Jian-Chao Song and Kun Li. These partnerships have fostered a creative environment that has led to the development of innovative solutions in the tech industry.

Conclusion

Ding Feng's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the design and functionality of electronic devices, showcasing the importance of innovation in today's technological landscape.