Dinesh A Badami

Title: Dinesh A Badami: Innovator in Interconnect Structures

Introduction

Dinesh A Badami is a prominent inventor based in Essex Junction, VT (US). He has made significant contributions to the field of interconnect structures, holding a total of 6 patents. His work focuses on enhancing the efficiency and effectiveness of interconnect technologies.

Latest Patents

One of Dinesh's latest patents involves an innovative interconnect structure. This structure includes a dielectric layer with one or more trenches extending therein, along with one or more interconnect lines and first liner layers. Each interconnect line is strategically positioned within a trench, with at least one first liner layer affixed between the trench bottom surface and the interconnect bottom surface. The design also incorporates second liner layers, with at least one affixed directly to the interconnect top surface and at least one interconnect side surface. Additionally, the structure features air gaps positioned between the trench side surface and the interconnect side surface. A corresponding method of manufacture and product of a method of manufacture are also disclosed in this patent.

Career Highlights

Dinesh A Badami is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to explore and develop advanced technologies in the realm of interconnect structures, contributing to the company's reputation for innovation.

Collaborations

Dinesh has collaborated with notable coworkers, including Baozhen Li and Tom C Lee. These collaborations have further enriched his work and have led to advancements in the technologies he has developed.

Conclusion

Dinesh A Badami is a distinguished inventor whose contributions to interconnect structures have made a significant impact in the field. His innovative patents and collaborations reflect his commitment to advancing technology and enhancing efficiency in interconnect systems.