Company Filing History:
Years Active: 2018
Title: Dinc Erdeniz: Innovator in Transient Liquid Phase Bonding
Introduction
Dinc Erdeniz is a notable inventor based in Evanston, Illinois. He has made significant contributions to the field of materials science, particularly in the bonding of nickel-based alloys. His innovative work has led to the development of a unique patent that enhances the properties of these materials.
Latest Patents
Dinc Erdeniz holds a patent for "Transient liquid phase (TLP) bonding of nickel based alloys by forming an aluminum-titanium coating and subsequent heat treatment." This invention provides a transient liquid phase bonding structure, which includes nickel-based alloys and a TLP bonded layer formed by pack cementation. The pack composition used in this process consists of 57 wt. % aluminum oxide powder, 30 wt. % titanium powder, 10 wt. % nickel-50 wt. % aluminum alloy powder, and 3 wt. % ammonium chloride powder. The nickel-based alloys may include Ni-20 wt. % chromium alloys. The process involves performing pack cementation under argon for an hour, followed by sonication in acetone and annealing under vacuum at approximately 1200°C for two days. This results in a TLP bonding structure with a uniform γ' phase distribution.
Career Highlights
Dinc Erdeniz is affiliated with Northwestern University, where he continues to advance research in materials science. His work has garnered attention for its innovative approach to enhancing the bonding of nickel-based alloys, which has implications for various industrial applications.
Collaborations
Dinc Erdeniz collaborates with David C. Dunand, a fellow researcher in the field. Their partnership has contributed to the development of advanced materials and bonding techniques.
Conclusion
Dinc Erdeniz's contributions to the field of materials science, particularly through his patent on transient liquid phase bonding, highlight his role as an innovator. His work at Northwestern University and collaborations with other researchers continue to push the boundaries of technology in this area.