The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Jan. 08, 2015
Northwestern University, Evanston, IL (US);
David C. Dunand, Evanston, IL (US);
Dinc Erdeniz, Evanston, IL (US);
NORTHWESTERN UNIVERSITY, Evanston, IL (US);
Abstract
Certain aspects of the invention provides a transient liquid phase (TLP) bonding structure, including Ni based alloys and a TLP bonded layer formed by pack cementation on the Ni based alloys using a pack composition. In one embodiment, the pack composition includes 57 wt. % of aluminum oxide powder, 30 wt. % of Ti powder, 10 wt. % of Ni-50 wt. % Al alloy powder and 3 wt. % of ammonium chloride powder. The Ni based alloys may be Ni-20 wt. % Cr alloys. In certain embodiments, pack cementation is performed on the Ni based alloys under argon for an hour using the pack composition to form a coating. Then the structure is sonicated in acetone for 2 hours, and then annealed under vacuum at about 1200° C. for 2 days to form the TLP bonding structure, which has a uniform γ' phase distribution with identical compositions and properties at its bonding regions.