This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1979-1987.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Schoenaich, DE (1979)
- Schonaich, DE (1985 - 1987)
Company Filing History:
Years Active: 1979-1987
Title: Dieter K Bahrle: Innovator in Printed Circuit Technology
Introduction
Dieter K Bahrle is a notable inventor based in Schonaich, Germany. He has made significant contributions to the field of printed circuit technology, holding a total of 3 patents. His innovative approaches have led to more efficient and environmentally friendly processes in circuit production.
Latest Patents
One of Bahrle's latest patents is a process for producing printed circuits that includes a dry substrate activation process and copper deposition without electroless plating. This method requires fewer wet chemical baths, making it less environmentally hazardous and more efficient than conventional processes. The process involves laminating sacrificial copper layers to the surface of a prepreg substrate, drilling through holes, and then removing the sacrificial layer by etching. Copper is subsequently sputter deposited on the substrate surface and the walls of the through holes. The application of photoresist, followed by exposure and development, creates the desired pattern of circuit lines. Finally, copper is deposited in the photoresist channels and on the through hole walls by electroplating, with the exposed sputtered copper removed by differential etching.
Another significant patent by Bahrle is a method of making printed circuits with one conductor plane. In this method, sacrificial foils are laminated onto a synthetic resin prepreg on both sides. After drilling through-holes, the copper foil is etched off. A negative photoresist foil is then laminated onto the roughened surface of the prepreg. The foil is exposed and developed according to the conductive pattern, followed by sputtering copper onto the photoresist surface and the drilled holes. The copper sputtered onto the photoresist is removed using a scrubbing roller, and copper is deposited in accordance with the additive process on the sputtered copper in the photoresist channels and drilled holes. The printed circuit is completed after stripping the photoresist.
Career Highlights
Dieter K Bahrle is currently associated with International Business Machines Corporation (IBM), where he continues to innovate in the field of printed circuits. His work has significantly advanced the efficiency and environmental sustainability of circuit production processes.
Collaborations
Bahrle has collaborated with notable coworkers such as Friedrich W Schwerdt and Peter U Frasch, contributing to the development of advanced technologies in printed circuit manufacturing.
Conclusion
Dieter K Bahrle
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
