Garrett, IN, United States of America

Dick E Cleveland

This inventor holds 1 USPTO granted patent. Top assignee: Dana Corporation. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dick E Cleveland. Retrieved from https://idiyas.com/inventor/dick-e-cleveland

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Dick E. Cleveland and the Modular Yoke End

Introduction

Dick E. Cleveland is an inventor associated with Garrett, Indiana, and Dana Corporation. His recorded patent concerns a modular power-drive assembly designed to secure a shaft and yoke against axial and rotational movement. Cleveland is credited with 1 patent.

Latest Patents

Cleveland’s listed patent is “Modular Yoke End.” It describes an assembly with a plain carbon-steel driving shaft and an externally splined connection end, joined to a cast-iron yoke with a hub. In the preferred design, the hub has an internally splined portion that mates with the shaft’s external splines. The splined parts are press-fitted to create an interference fit, and bonding adhesive is applied between them. Together, these features secure the yoke and shaft against axial and rotational movement relative to one another.

Career Highlights

Cleveland’s documented invention focuses on the mechanical connection between a drive shaft and a yoke. The design combines a press-fitted splined joint with adhesive bonding to provide a fixed connection.

Collaborations

Cleveland is associated with Dana Corporation. Dee E. Bear and Fred Osborne are identified as his coworkers.

Conclusion

Dick E. Cleveland’s “Modular Yoke End” patent describes a bonded, press-fitted splined connection intended to keep a power-drive shaft and yoke securely joined.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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